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MEMS (Micro-Electro-Mechanical Systems) - STMicroelectronics
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CALCE Battery Group - UMD
WebNov 7, 2013 · Hence, extended reliability is crucial to determine the lifetime of gold and copper ball bonds (Pd-coated or Pd-doped) in microelectronics packaging. The motivation of this study is to apply wearout lifetime study on newer Pd-doped Cu wire and compare the post stresses IMC thicknesses, wire pull strength and ball bond shear strength to ... WebApr 1, 1997 · @article{osti_477773, title = {Assessment of microelectronics packaging for high temperature, high reliability applications}, author = {Uribe, F}, abstractNote = {This report details characterization and development activities in electronic packaging for high temperature applications. This project was conducted through a Department of Energy … WebThe Most Advanced US Foundry for Rad-Hard by Process Technologies. SkyWater’s 90 nm FDSOI technology can enable a range of extreme environment applications including radiation environments and high-temperature applications. The process can enable strategic rad-hard by process requirements and advances the state of the art for these ... highest rated csi season